A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the.
The theory and fundamental physics associated with wet etching and wet cleaning is reviewed,. Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field.
Iconic experts Robert. The book explains the fundamentals, properties mechanical, electrostatic, optical, etc. Evaluating the effectiveness of conventional wet processes for cleaning silicon wafers in semiconductor production, this reference reveals concrete measures to improve ultrapure water quality reviewing the structure and physical characteristics of ultrapure water molecules. The volume is divided int. Novak, published by The Electrochemical Society which was released on Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods.
This newest volume in the series discusses. As device sizes in the semiconductor industries shrink, devices become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not effective at smaller scales. Easy - Download and start reading immediately. Flexible - Read on multiple operating systems and devices. Easily read eBooks on smart phones, computers, or any eBook readers, including Kindle.
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Free Global Shipping. Description The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol.
The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. It provides the first comprehensive and up-to-date coverage of this rapidly evolving field. Its thirteen chapters were written by nineteen scientists who are recognized experts in each topic.
Emphasis is on practical applications in the fab combined with authoritative scientific background information to provide a solid scientific basis for understanding the chemical and physical processes involved in cleaning and in the analytical methods of testing and evaluation.
The volume is intended to serve as a handbook for practitioners and professionals in the field of semiconductor microelectronics, including fab engineers, scientists and technicians.
It should also prove useful to manufacturers of processing equipment, persons concerned with contamination control and analysis, and students attending advanced or specialized technical courses. All Rights Reserved. A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties mechanical, electrostatic, optical, etc , manufacturing, processing, measuring incl.
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field.
Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available.
Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing.
From the Reviews Many engineering librarians who work with a variety of programs including, but not limited to Materials Engineering should include this work in their collection.
The book explains the fundamentals, properties mechanical, electrostatic, optical, etc. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs.
Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties mechanical, electrostatic, optical, etc.
Developments in Surface Contamination and Cleaning: Methods for Surface Cleaning, Volume 9, part of the Developments in Surface Contamination and Cleaning series provide a state-of-the-art guide to the current knowledge on the behavior of film-type and particulate surface contaminants and their associated cleaning methods.
This newest volume in the series discusses methods of surface cleaning of contaminants and the resources that are needed to deal with them. Taken as a whole, the series forms a unique reference for professionals and academics working in the area of surface contamination and cleaning. A strong theme running through the series is that of surface contamination and cleaning at the micro and nano scales. Provides a comprehensive coverage of innovations in surface cleaning Written by established experts in the surface cleaning field, presenting an authoritative resource Contains a comprehensive review of the state-of-the-art, including case studies to enhance the learning process.
Evaluating the effectiveness of conventional wet processes for cleaning silicon wafers in semiconductor production, this reference reveals concrete measures to improve ultrapure water quality reviewing the structure and physical characteristics of ultrapure water molecules. The volume is divided int. As device sizes in the semiconductor industries shrink, devices become more vulnerable to smaller contaminant particles, and most conventional cleaning techniques employed in the industry are not effective at smaller scales.
The book series Developments in Surface Contamination and Cleaning as a whole provides an excellent source of information on these alternative cleaning techniques as well as methods for characterization and validation of surface contamination.
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